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Mendeley readers
| Title |
Wafer-Level Chip-Scale Packaging
|
|---|---|
| Published by |
Springer New York, September 2014
|
| DOI | 10.1007/978-1-4939-1556-9 |
| ISBNs |
978-1-4939-1555-2, 978-1-4939-1556-9
|
| Authors |
Qu, Shichun, Liu, Yong |
Mendeley readers
The data shown below were compiled from readership statistics for 20 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 20 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 7 | 35% |
| Researcher | 5 | 25% |
| Student > Master | 2 | 10% |
| Lecturer > Senior Lecturer | 1 | 5% |
| Unspecified | 1 | 5% |
| Other | 1 | 5% |
| Unknown | 3 | 15% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 10 | 50% |
| Materials Science | 3 | 15% |
| Unspecified | 1 | 5% |
| Chemical Engineering | 1 | 5% |
| Physics and Astronomy | 1 | 5% |
| Other | 0 | 0% |
| Unknown | 4 | 20% |