You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output.
Click here to find out more.
Mendeley readers
Chapter title |
Chip Scale Package Assembly Reliability
|
---|---|
Chapter number | 23 |
Book title |
Area Array Interconnection Handbook
|
Published by |
Springer, Boston, MA, January 2001
|
DOI | 10.1007/978-1-4615-1389-6_23 |
Book ISBNs |
978-1-4613-5529-8, 978-1-4615-1389-6
|
Authors |
Reza Ghaffarian |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Master | 1 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 1 | 100% |