Area Array Interconnection Handbook

Table of Contents

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   Book Overview
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   Chapter 1 History of Flip Chip and Area Array Technology
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   Chapter 2 Wafer Bumping
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   Chapter 3 Wafer-Level Test
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   Chapter 4 Known Good Die (KGD)
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   Chapter 5 Wafer Finishing—Dicing,Picking,Shipping
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   Chapter 6 Ceramic Chip Carriers
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   Chapter 7 Laminate/HDI Die Carriers
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   Chapter 8 Flip-Chip Die Attach Technology
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    Chapter 9 Solder Bump Flip-Chip Replacement Technology on Ceramic Carriers
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    Chapter 10 Manufacturing Considerations and Tools for Flip Chip Assembly
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    Chapter 11 Test and Burn-in Sockets
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    Chapter 12 Underfill: The Enabling Technology for Flip-Chip Packaging
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    Chapter 13 Reliability of Die-Level Interconnections
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    Chapter 14 Ceramic and Plastic Pin Grid Array Technology
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    Chapter 15 Plastic Ball Grid Array
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    Chapter 16 Tape Ball Grid Array
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    Chapter 17 Ceramic Ball and Column Grid Arrays
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    Chapter 18 Chip Scale Package Technology
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    Chapter 19 Assembly of Area Array Components
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    Chapter 20 Area Array Component Replacement Technology
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    Chapter 21 Product Connector Technology
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    Chapter 22 Board-Level Area Array Interconnect Reliability
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    Chapter 23 Chip Scale Package Assembly Reliability
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    Chapter 24 Area-array Design Principles
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    Chapter 25 Area Array Leverages: Why and How to Choose a Package
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    Chapter 26 Interconnections for High-Frequency Applications
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    Chapter 27 Thermal Performance
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    Chapter 28 Metallurgical Factors