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Area Array Interconnection Handbook

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Cover of 'Area Array Interconnection Handbook'

Table of Contents

  1. Altmetric Badge
    Book Overview
  2. Altmetric Badge
    Chapter 1 History of Flip Chip and Area Array Technology
  3. Altmetric Badge
    Chapter 2 Wafer Bumping
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    Chapter 3 Wafer-Level Test
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    Chapter 4 Known Good Die (KGD)
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    Chapter 5 Wafer Finishing—Dicing,Picking,Shipping
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    Chapter 6 Ceramic Chip Carriers
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    Chapter 7 Laminate/HDI Die Carriers
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    Chapter 8 Flip-Chip Die Attach Technology
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    Chapter 9 Solder Bump Flip-Chip Replacement Technology on Ceramic Carriers
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    Chapter 10 Manufacturing Considerations and Tools for Flip Chip Assembly
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    Chapter 11 Test and Burn-in Sockets
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    Chapter 12 Underfill: The Enabling Technology for Flip-Chip Packaging
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    Chapter 13 Reliability of Die-Level Interconnections
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    Chapter 14 Ceramic and Plastic Pin Grid Array Technology
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    Chapter 15 Plastic Ball Grid Array
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    Chapter 16 Tape Ball Grid Array
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    Chapter 17 Ceramic Ball and Column Grid Arrays
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    Chapter 18 Chip Scale Package Technology
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    Chapter 19 Assembly of Area Array Components
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    Chapter 20 Area Array Component Replacement Technology
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    Chapter 21 Product Connector Technology
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    Chapter 22 Board-Level Area Array Interconnect Reliability
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    Chapter 23 Chip Scale Package Assembly Reliability
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    Chapter 24 Area-array Design Principles
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    Chapter 25 Area Array Leverages: Why and How to Choose a Package
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    Chapter 26 Interconnections for High-Frequency Applications
  28. Altmetric Badge
    Chapter 27 Thermal Performance
  29. Altmetric Badge
    Chapter 28 Metallurgical Factors
Overall attention for this book and its chapters
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37 Mendeley
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Title
Area Array Interconnection Handbook
Published by
Springer US, December 2012
DOI 10.1007/978-1-4615-1389-6
ISBNs
978-1-4613-5529-8, 978-1-4615-1389-6
Editors

Puttlitz, Karl J., Totta, Paul A.

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 37 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 37 100%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 7 19%
Student > Bachelor 6 16%
Student > Master 5 14%
Researcher 3 8%
Other 2 5%
Other 2 5%
Unknown 12 32%
Readers by discipline Count As %
Engineering 14 38%
Materials Science 3 8%
Energy 3 8%
Physics and Astronomy 2 5%
Computer Science 1 3%
Other 1 3%
Unknown 13 35%