Area Array Interconnection Handbook
Springer US
Chapter title |
Wafer Finishing—Dicing,Picking,Shipping
|
---|---|
Chapter number | 5 |
Book title |
Area Array Interconnection Handbook
|
Published by |
Springer, Boston, MA, January 2001
|
DOI | 10.1007/978-1-4615-1389-6_5 |
Book ISBNs |
978-1-4613-5529-8, 978-1-4615-1389-6
|
Authors |
Lyman R. Clark, Mark Brown, Scott Evans, Steve Bedore, Charles E. Gutentag, Robert A. Sierra |
Country | Count | As % |
---|---|---|
Unknown | 3 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Master | 2 | 67% |
Unknown | 1 | 33% |
Readers by discipline | Count | As % |
---|---|---|
Physics and Astronomy | 1 | 33% |
Engineering | 1 | 33% |
Unknown | 1 | 33% |