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Integrated Circuit Packaging, Assembly and Interconnections

Overview of attention for book
Cover of 'Integrated Circuit Packaging, Assembly and Interconnections'

Table of Contents

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    Book Overview
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    Chapter 1 Electronic Manufacturing and the Integrated Circuit
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    Chapter 2 Integrated Circuit Manufacturing: A Technology Resource
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    Chapter 3 Packaging the IC—Single Chip Packaging
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    Chapter 4 The Chip Scale Package
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    Chapter 5 Multichip Packaging
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    Chapter 6 Known Good Die (KGD)
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    Chapter 7 Packaging Options—Chip on Board
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    Chapter 8 Chip & Wire Assembly
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    Chapter 9 Tape Automated Bonding—TAB
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    Chapter 10 Flip Chip—The Bumping Processes
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    Chapter 11 Flip Chip Assembly
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    Chapter 12 HDI Substrate Manufacturing Technologies: Thin Film Technology
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    Chapter 13 HDI Substrate Manufacturing Technologies: Thick Film Technology
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    Chapter 14 HDI Substrate Manufacturing Technologies: Cofired Ceramic
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    Chapter 15 Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate
Attention for Chapter 8: Chip & Wire Assembly
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