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Mendeley readers
| Chapter title |
Chip & Wire Assembly
|
|---|---|
| Chapter number | 8 |
| Book title |
Integrated Circuit Packaging, Assembly and Interconnections
|
| Published by |
Springer, Boston, MA, January 2007
|
| DOI | 10.1007/0-387-33913-2_8 |
| Book ISBNs |
978-0-387-28153-7, 978-0-387-33913-9
|
Mendeley readers
The data shown below were compiled from readership statistics for 9 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| United States | 1 | 11% |
| Unknown | 8 | 89% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 4 | 44% |
| Student > Ph. D. Student | 2 | 22% |
| Student > Postgraduate | 1 | 11% |
| Professor > Associate Professor | 1 | 11% |
| Unknown | 1 | 11% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 5 | 56% |
| Materials Science | 1 | 11% |
| Physics and Astronomy | 1 | 11% |
| Unknown | 2 | 22% |