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Mendeley readers
| Title |
Integrated Circuit Packaging, Assembly and Interconnections
|
|---|---|
| Published by |
Springer US, January 2007
|
| DOI | 10.1007/0-387-33913-2 |
| ISBNs |
978-0-387-33913-9, 978-0-387-28153-7, 978-1-4419-3923-4
|
| Authors |
William Greig, Greig, William J. |
Mendeley readers
The data shown below were compiled from readership statistics for 98 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| United States | 1 | 1% |
| Unknown | 97 | 99% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 24 | 24% |
| Student > Ph. D. Student | 21 | 21% |
| Student > Bachelor | 17 | 17% |
| Researcher | 9 | 9% |
| Other | 7 | 7% |
| Other | 4 | 4% |
| Unknown | 16 | 16% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 63 | 64% |
| Materials Science | 9 | 9% |
| Chemistry | 4 | 4% |
| Physics and Astronomy | 3 | 3% |
| Medicine and Dentistry | 1 | 1% |
| Other | 1 | 1% |
| Unknown | 17 | 17% |