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| Chapter title |
Flip Chip Assembly
|
|---|---|
| Chapter number | 11 |
| Book title |
Integrated Circuit Packaging, Assembly and Interconnections
|
| Published by |
Springer, Boston, MA, January 2007
|
| DOI | 10.1007/0-387-33913-2_11 |
| Book ISBNs |
978-0-387-28153-7, 978-0-387-33913-9
|