Copper Wire Bonding

Overview of attention for book

Cover of 'Copper Wire Bonding'

Table of Contents

Attention for Chapter 2: Bonding Process

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Citations

dimensions_citation: 45 Dimensions

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So far, Dimensions has found 45 publications that cite this research output.

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The most recent citing publications are shown below. View all 45 publications that cite this research output on Dimensions.

Key Technologies and Processes for Traditional Packaging

Book chapter (November 2023)

Bond Wire Fatigue of Au, Cu, and PCC in Power LED Packages †

Article in Micromachines (October 2023)

Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging

Article in Micromachines (July 2023)

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