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| Chapter title |
Thermal Reliability Tests
|
|---|---|
| Chapter number | 5 |
| Book title |
Copper Wire Bonding
|
| Published by |
Springer, New York, NY, January 2014
|
| DOI | 10.1007/978-1-4614-5761-9_5 |
| Book ISBNs |
978-1-4614-5760-2, 978-1-4614-5761-9
|
| Authors |
Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht |