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Mendeley readers
| Title |
Copper Wire Bonding
|
|---|---|
| Published by |
Springer-Verlag New York, January 2014
|
| DOI | 10.1007/978-1-4614-5761-9 |
| ISBNs |
978-1-4614-5761-9, 978-1-4614-5760-2, 978-1-4939-5349-3
|
| Authors |
Preeti S Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G Pecht, Chauhan, Preeti S, Choubey, Anupam, Zhong, ZhaoWei, Pecht, Michael G |
Mendeley readers
The data shown below were compiled from readership statistics for 88 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Malaysia | 1 | 1% |
| France | 1 | 1% |
| Unknown | 86 | 98% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 26 | 30% |
| Student > Master | 15 | 17% |
| Student > Bachelor | 11 | 13% |
| Researcher | 7 | 8% |
| Other | 5 | 6% |
| Other | 11 | 13% |
| Unknown | 13 | 15% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 38 | 43% |
| Materials Science | 12 | 14% |
| Physics and Astronomy | 9 | 10% |
| Chemical Engineering | 2 | 2% |
| Chemistry | 2 | 2% |
| Other | 6 | 7% |
| Unknown | 19 | 22% |