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Mendeley readers
| Chapter title |
Copper Wire Bonding
|
|---|---|
| Chapter number | 1 |
| Book title |
Copper Wire Bonding
|
| Published by |
Springer, New York, NY, January 2014
|
| DOI | 10.1007/978-1-4614-5761-9_1 |
| Book ISBNs |
978-1-4614-5760-2, 978-1-4614-5761-9
|
| Authors |
Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht |
Mendeley readers
The data shown below were compiled from readership statistics for 13 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 13 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Master | 6 | 46% |
| Student > Ph. D. Student | 2 | 15% |
| Student > Bachelor | 2 | 15% |
| Researcher | 1 | 8% |
| Unknown | 2 | 15% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 4 | 31% |
| Materials Science | 3 | 23% |
| Chemistry | 1 | 8% |
| Physics and Astronomy | 1 | 8% |
| Unknown | 4 | 31% |