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=> "3D Microelectronic Packaging: From Architectures to Applications", Yan Li, & Deepak Goyal, Intel, 2021 https://t.co/LwKTaIdrSS 18 chapters, 622 pages A comprehensive reference guide for graduate students and professionals in both academia and in
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RT @ogawa_tter: => "3D Packaging Architectures and Assembly Process Design", Ravi Mahajan (Intel) and Bob Sankman, in 3D Microelectronic Pa…
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=> "3D Packaging Architectures and Assembly Process Design", Ravi Mahajan (Intel) and Bob Sankman, in 3D Microelectronic Packaging, Nov 24, 2020 https://t.co/6IXTsUtD8D R. Mahajan, EDPS 2020 https://t.co/Esqf1FxuPo 3D Microelectronic Packaging https://