3D Microelectronic Packaging
Springer Singapore
Chapter title |
Fundamentals of Advanced Materials and Processes in Organic Substrate Technology
|
---|---|
Chapter number | 14 |
Book title |
3D Microelectronic Packaging
|
Published in |
Springer Series in Advanced Microelectronics, November 2020
|
DOI | 10.1007/978-981-15-7090-2_14 |
Book ISBNs |
978-9-81-157089-6, 978-9-81-157090-2
|
Authors |
Songhua Shi, Peter Tortorici, Sai Vadlamani, Prithwish Chatterjee, Shi, Songhua, Tortorici, Peter, Vadlamani, Sai, Chatterjee, Prithwish |
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Type | Count | As % |
---|---|---|
Members of the public | 1 | 100% |
Country | Count | As % |
---|---|---|
Unknown | 14 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 2 | 14% |
Lecturer > Senior Lecturer | 1 | 7% |
Student > Doctoral Student | 1 | 7% |
Student > Bachelor | 1 | 7% |
Student > Master | 1 | 7% |
Other | 2 | 14% |
Unknown | 6 | 43% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 3 | 21% |
Materials Science | 2 | 14% |
Computer Science | 1 | 7% |
Agricultural and Biological Sciences | 1 | 7% |
Physics and Astronomy | 1 | 7% |
Other | 0 | 0% |
Unknown | 6 | 43% |