3D Microelectronic Packaging
Springer Singapore
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X Demographics
| Title |
3D Microelectronic Packaging
|
|---|---|
| Published by |
Springer Singapore, January 2021
|
| DOI | 10.1007/978-981-15-7090-2 |
| ISBNs |
978-9-81-157089-6, 978-9-81-157090-2
|
| Editors |
Yan Li, Deepak Goyal |
X Demographics
The data shown below were collected from the profiles of 3 X users who shared this research output. Click here to find out more about how the information was compiled.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 3 | 100% |
Demographic breakdown
| Type | Count | As % |
|---|---|---|
| Members of the public | 3 | 100% |