3D Stacked Chips
Springer International Publishing
Title |
3D Stacked Chips
|
---|---|
Published by |
Springer International Publishing, January 2016
|
DOI | 10.1007/978-3-319-20481-9 |
ISBNs |
978-3-31-920480-2, 978-3-31-920481-9
|
Editors |
Ibrahim (Abe) M. Elfadel, Gerhard Fettweis |
Country | Count | As % |
---|---|---|
United Arab Emirates | 3 | 50% |
Unknown | 3 | 50% |
Type | Count | As % |
---|---|---|
Members of the public | 6 | 100% |
Country | Count | As % |
---|---|---|
Malaysia | 1 | 5% |
Unknown | 20 | 95% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 9 | 43% |
Researcher | 3 | 14% |
Student > Master | 2 | 10% |
Professor | 1 | 5% |
Student > Doctoral Student | 1 | 5% |
Other | 0 | 0% |
Unknown | 5 | 24% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 9 | 43% |
Energy | 2 | 10% |
Computer Science | 1 | 5% |
Materials Science | 1 | 5% |
Chemistry | 1 | 5% |
Other | 0 | 0% |
Unknown | 7 | 33% |