3D Stacked Chips
Springer International Publishing
Chapter title |
Optical Through-Silicon Vias
|
---|---|
Chapter number | 12 |
Book title |
3D Stacked Chips
|
Published by |
Springer, Cham, January 2016
|
DOI | 10.1007/978-3-319-20481-9_12 |
Book ISBNs |
978-3-31-920480-2, 978-3-31-920481-9
|
Authors |
Sebastian Killge, Niels Neumann, Dirk Plettemeier, Johann W. Bartha |
Country | Count | As % |
---|---|---|
Unknown | 8 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Researcher | 3 | 38% |
Student > Master | 1 | 13% |
Unknown | 4 | 50% |
Readers by discipline | Count | As % |
---|---|---|
Earth and Planetary Sciences | 1 | 13% |
Chemistry | 1 | 13% |
Engineering | 1 | 13% |
Design | 1 | 13% |
Unknown | 4 | 50% |