3D Stacked Chips
Springer International Publishing
Chapter title |
Energy Efficient TSV Based Communication Employing 1-Bit Quantization at the Receiver
|
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Chapter number | 5 |
Book title |
3D Stacked Chips
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Published by |
Springer, Cham, January 2016
|
DOI | 10.1007/978-3-319-20481-9_5 |
Book ISBNs |
978-3-31-920480-2, 978-3-31-920481-9
|
Authors |
Lukas Landau, Gerhard Fettweis |