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Mendeley readers
| Chapter title |
Why Are Silicon Wafers as Thick as They Are?
|
|---|---|
| Chapter number | 1 |
| Book title |
Ultra-thin Chip Technology and Applications
|
| Published by |
Springer, New York, NY, January 2011
|
| DOI | 10.1007/978-1-4419-7276-7_1 |
| Book ISBNs |
978-1-4419-7275-0, 978-1-4419-7276-7
|
| Authors |
Peter Stallhofer, Stallhofer, Peter |
Mendeley readers
The data shown below were compiled from readership statistics for 4 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 4 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 25% |
| Student > Doctoral Student | 1 | 25% |
| Unknown | 2 | 50% |
| Readers by discipline | Count | As % |
|---|---|---|
| Economics, Econometrics and Finance | 1 | 25% |
| Physics and Astronomy | 1 | 25% |
| Engineering | 1 | 25% |
| Unknown | 1 | 25% |