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Mendeley readers
Chapter title |
Fabrication of Ultra-thin Chips Using Silicon Wafers with Buried Cavities
|
---|---|
Chapter number | 8 |
Book title |
Ultra-thin Chip Technology and Applications
|
Published by |
Springer, New York, NY, January 2011
|
DOI | 10.1007/978-1-4419-7276-7_8 |
Book ISBNs |
978-1-4419-7275-0, 978-1-4419-7276-7
|
Authors |
Martin Zimmermann, Joachim N. Burghartz, Wolfgang Appel, Christine Harendt, Zimmermann, Martin, Burghartz, Joachim N., Appel, Wolfgang, Harendt, Christine |
Mendeley readers
The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
France | 1 | 33% |
Unknown | 2 | 67% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Student > Doctoral Student | 2 | 67% |
Student > Ph. D. Student | 1 | 33% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 2 | 67% |
Chemistry | 1 | 33% |