↓ Skip to main content

Ultra-thin Chip Technology and Applications

Overview of attention for book
Cover of 'Ultra-thin Chip Technology and Applications'

Table of Contents

  1. Altmetric Badge
    Book Overview
  2. Altmetric Badge
    Chapter 1 Why Are Silicon Wafers as Thick as They Are?
  3. Altmetric Badge
    Chapter 2 Thin Chips on the ITRS Roadmap
  4. Altmetric Badge
    Chapter 3 Thin Wafer Manufacturing and Handling Using Low Cost Carriers
  5. Altmetric Badge
    Chapter 4 Ultra-thin Wafer Fabrication Through Dicing-by-Thinning
  6. Altmetric Badge
    Chapter 5 Thin Wafer Handling and Processing without Carrier Substrates
  7. Altmetric Badge
    Chapter 6 Epitaxial Growth and Selective Etching Techniques
  8. Altmetric Badge
    Chapter 7 Silicon-on-Insulator (SOI) Wafer-Based Thin-Chip Fabrication
  9. Altmetric Badge
    Chapter 8 Fabrication of Ultra-thin Chips Using Silicon Wafers with Buried Cavities
  10. Altmetric Badge
    Chapter 9 Through-Silicon Vias Using Bosch DRIE Process Technology
  11. Altmetric Badge
    Chapter 10 Through-Silicon via Technology for 3D IC
  12. Altmetric Badge
    Chapter 11 3D-IC Technology Using Ultra-Thin Chips
  13. Altmetric Badge
    Chapter 12 Substrate Handling Techniques for Thin Wafer Processing
  14. Altmetric Badge
    Chapter 13 System-in-Foil Technology
  15. Altmetric Badge
    Chapter 14 Chip Embedding in Laminates
  16. Altmetric Badge
    Chapter 15 Handling of Thin Dies with Emphasis on Chip-to-Wafer Bonding
  17. Altmetric Badge
    Chapter 16 Micro Bump Assembly
  18. Altmetric Badge
    Chapter 17 Mechanical Characterisation and Modelling of Thin Chips
  19. Altmetric Badge
    Chapter 18 Structure Impaired Mechanical Stability of Ultra-thin Chips
  20. Altmetric Badge
    Chapter 19 Piezoresistive Effect in MOSFETS
  21. Altmetric Badge
    Chapter 20 Electrical Device Characterisation on Ultra-thin Chips
  22. Altmetric Badge
    Chapter 21 MOS Compact Modelling for Flexible Electronics
  23. Altmetric Badge
    Chapter 22 Piezojunction Effect: Stress Influence on Bipolar Transistors
  24. Altmetric Badge
    Chapter 23 Thermal Effects in Thin Silicon Dies: Simulation and Modelling
  25. Altmetric Badge
    Chapter 24 Optical Characterisation of Thin Silicon
  26. Altmetric Badge
    Chapter 25 Thin Chips for Power Applications
  27. Altmetric Badge
    Chapter 26 Thinned Backside-Illuminated (BSI) Imagers
  28. Altmetric Badge
    Chapter 27 Thin Solar Cells
  29. Altmetric Badge
    Chapter 28 Bendable Electronics for Retinal Implants
  30. Altmetric Badge
    Chapter 29 Thin Chip Flow Sensors for Nonplanar Assembly
  31. Altmetric Badge
    Chapter 30 RFID Transponders
  32. Altmetric Badge
    Chapter 31 Thin Chips for Document Security
  33. Altmetric Badge
    Chapter 32 Flexible Display Driver Chips
  34. Altmetric Badge
    Chapter 33 Microwave Passive Components in Thin Film Technology
  35. Altmetric Badge
    Chapter 34 Through-Silicon via Technology for RF and Millimetre-Wave Applications
Overall attention for this book and its chapters
Altmetric Badge

Mentioned by

news
1 news outlet
wikipedia
2 Wikipedia pages

Citations

dimensions_citation
94 Dimensions

Readers on

mendeley
85 Mendeley
You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output. Click here to find out more.
Title
Ultra-thin Chip Technology and Applications
Published by
Springer New York, November 2010
DOI 10.1007/978-1-4419-7276-7
ISBNs
978-1-4419-7275-0, 978-1-4419-7276-7
Editors

Burghartz, Joachim

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 85 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Mexico 1 1%
France 1 1%
Germany 1 1%
Egypt 1 1%
Unknown 81 95%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 25 29%
Researcher 17 20%
Student > Master 8 9%
Student > Bachelor 6 7%
Student > Postgraduate 6 7%
Other 13 15%
Unknown 10 12%
Readers by discipline Count As %
Engineering 47 55%
Materials Science 7 8%
Chemistry 5 6%
Computer Science 3 4%
Physics and Astronomy 3 4%
Other 8 9%
Unknown 12 14%