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Mendeley readers
Chapter title |
Micro Bump Assembly
|
---|---|
Chapter number | 16 |
Book title |
Ultra-thin Chip Technology and Applications
|
Published by |
Springer, New York, NY, January 2011
|
DOI | 10.1007/978-1-4419-7276-7_16 |
Book ISBNs |
978-1-4419-7275-0, 978-1-4419-7276-7
|
Authors |
Paresh Limaye, Wenqi Zhang, Limaye, Paresh, Zhang, Wenqi |
Mendeley readers
The data shown below were compiled from readership statistics for 13 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 13 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Researcher | 3 | 23% |
Student > Doctoral Student | 2 | 15% |
Student > Ph. D. Student | 2 | 15% |
Other | 1 | 8% |
Student > Master | 1 | 8% |
Other | 1 | 8% |
Unknown | 3 | 23% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 4 | 31% |
Materials Science | 2 | 15% |
Physics and Astronomy | 1 | 8% |
Business, Management and Accounting | 1 | 8% |
Chemistry | 1 | 8% |
Other | 0 | 0% |
Unknown | 4 | 31% |