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Mendeley readers
| Chapter title |
Advanced Wire Bonding Technology: Materials, Methods, and Testing
|
|---|---|
| Chapter number | 4 |
| Book title |
Materials for Advanced Packaging
|
| Published by |
Springer, Cham, January 2017
|
| DOI | 10.1007/978-3-319-45098-8_4 |
| Book ISBNs |
978-3-31-945097-1, 978-3-31-945098-8
|
| Authors |
Harry K. Charles, Charles, Harry K. |
Mendeley readers
The data shown below were compiled from readership statistics for 13 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 13 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 3 | 23% |
| Student > Doctoral Student | 2 | 15% |
| Researcher | 2 | 15% |
| Student > Bachelor | 1 | 8% |
| Student > Master | 1 | 8% |
| Other | 1 | 8% |
| Unknown | 3 | 23% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 8 | 62% |
| Chemical Engineering | 1 | 8% |
| Unknown | 4 | 31% |