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Materials for Advanced Packaging

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Cover of 'Materials for Advanced Packaging'

Table of Contents

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    Book Overview
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    Chapter 1 3D Integration Technologies: An Overview
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    Chapter 2 Advanced Bonding/Joining Techniques
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    Chapter 3 Advanced Chip-to-Substrate Connections
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    Chapter 4 Advanced Wire Bonding Technology: Materials, Methods, and Testing
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    Chapter 5 Lead-Free Soldering
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    Chapter 6 Thin Die Fabrication and Applications to Wafer Level System Integration
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    Chapter 7 Advanced Substrates: A Materials and Processing Perspective
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    Chapter 8 Flip-Chip Underfill: Materials, Process, and Reliability
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    Chapter 9 New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips
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    Chapter 10 Electrically Conductive Adhesives (ECAs)
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    Chapter 11 Die Attach Adhesives and Films
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    Chapter 12 Thermal Interface Materials
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    Chapter 13 Embedded Passives
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    Chapter 14 Advanced Bonding Technology Based on Nano- and Micro-metal Pastes
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    Chapter 15 Wafer Level Chip Scale Packaging
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    Chapter 16 Microelectromechanical Systems and Packaging
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    Chapter 17 LED Die Bonding
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    Chapter 18 Medical Electronics Design, Manufacturing, and Reliability
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    Chapter 19 Flexible and Printed Electronics
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    Chapter 20 Silicon Solar Cell Metallization Pastes
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    Chapter 21 Nano-metal-Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices
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    Chapter 22 Characterization of Copper Diffusion in Through Silicon Vias
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Citations

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Title
Materials for Advanced Packaging
Published by
Springer International Publishing, November 2016
DOI 10.1007/978-3-319-45098-8
ISBNs
978-3-31-945097-1, 978-3-31-945098-8
Editors

Lu, Daniel, Wong, C.P.

X Demographics

X Demographics

The data shown below were collected from the profile of 1 X user who shared this research output. Click here to find out more about how the information was compiled.
Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 57 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 57 100%

Demographic breakdown

Readers by professional status Count As %
Researcher 12 21%
Student > Ph. D. Student 11 19%
Student > Master 8 14%
Student > Bachelor 5 9%
Student > Doctoral Student 2 4%
Other 1 2%
Unknown 18 32%
Readers by discipline Count As %
Engineering 16 28%
Materials Science 8 14%
Chemistry 5 9%
Physics and Astronomy 1 2%
Energy 1 2%
Other 3 5%
Unknown 23 40%