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Chapter title |
Characterization of Copper Diffusion in Through Silicon Vias
|
---|---|
Chapter number | 22 |
Book title |
Materials for Advanced Packaging
|
Published by |
Springer, Cham, January 2017
|
DOI | 10.1007/978-3-319-45098-8_22 |
Book ISBNs |
978-3-31-945097-1, 978-3-31-945098-8
|
Authors |
Xiaodong Zhang, Shi-Wei Ricky Lee, Fuliang Le, Zhang, Xiaodong, Lee, Shi-Wei Ricky, Le, Fuliang |