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Mendeley readers
| Chapter title |
Thermal Interface Materials
|
|---|---|
| Chapter number | 12 |
| Book title |
Materials for Advanced Packaging
|
| Published by |
Springer, Cham, January 2017
|
| DOI | 10.1007/978-3-319-45098-8_12 |
| Book ISBNs |
978-3-31-945097-1, 978-3-31-945098-8
|
| Authors |
Ravi Prasher, Chia-Pin Chiu, Prasher, Ravi, Chiu, Chia-Pin |
Mendeley readers
The data shown below were compiled from readership statistics for 36 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 36 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Researcher | 8 | 22% |
| Student > Ph. D. Student | 8 | 22% |
| Student > Master | 4 | 11% |
| Student > Bachelor | 3 | 8% |
| Other | 1 | 3% |
| Other | 3 | 8% |
| Unknown | 9 | 25% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 15 | 42% |
| Physics and Astronomy | 3 | 8% |
| Materials Science | 3 | 8% |
| Chemical Engineering | 2 | 6% |
| Energy | 1 | 3% |
| Other | 1 | 3% |
| Unknown | 11 | 31% |