Advanced Materials for Thermal Management of Electronic Packaging
Springer New York
Chapter title |
Liquid Cooling Devices and Their Materials Selection
|
---|---|
Chapter number | 10 |
Book title |
Advanced Materials for Thermal Management of Electronic Packaging
|
Published by |
Springer, New York, NY, January 2011
|
DOI | 10.1007/978-1-4419-7759-5_10 |
Book ISBNs |
978-1-4419-7758-8, 978-1-4419-7759-5
|
Authors |
Xingcun Colin Tong, Tong, Xingcun Colin |
Country | Count | As % |
---|---|---|
Unknown | 8 | 100% |
Readers by professional status | Count | As % |
---|---|---|
Student > Ph. D. Student | 3 | 38% |
Student > Bachelor | 1 | 13% |
Lecturer | 1 | 13% |
Other | 1 | 13% |
Unknown | 2 | 25% |
Readers by discipline | Count | As % |
---|---|---|
Engineering | 6 | 75% |
Unknown | 2 | 25% |