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Mendeley readers
| Chapter title |
Thermoelectric Cooling Through Thermoelectric Materials
|
|---|---|
| Chapter number | 11 |
| Book title |
Advanced Materials for Thermal Management of Electronic Packaging
|
| Published by |
Springer, New York, NY, January 2011
|
| DOI | 10.1007/978-1-4419-7759-5_11 |
| Book ISBNs |
978-1-4419-7758-8, 978-1-4419-7759-5
|
| Authors |
Xingcun Colin Tong, Tong, Xingcun Colin |
Mendeley readers
The data shown below were compiled from readership statistics for 9 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 9 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 2 | 22% |
| Unspecified | 1 | 11% |
| Student > Bachelor | 1 | 11% |
| Researcher | 1 | 11% |
| Student > Master | 1 | 11% |
| Other | 0 | 0% |
| Unknown | 3 | 33% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 3 | 33% |
| Unspecified | 1 | 11% |
| Materials Science | 1 | 11% |
| Energy | 1 | 11% |
| Unknown | 3 | 33% |