You are seeing a free-to-access but limited selection of the activity Altmetric has collected about this research output.
Click here to find out more.
Mendeley readers
| Chapter title |
Characterization Methodologies of Thermal Management Materials
|
|---|---|
| Chapter number | 2 |
| Book title |
Advanced Materials for Thermal Management of Electronic Packaging
|
| Published by |
Springer, New York, NY, January 2011
|
| DOI | 10.1007/978-1-4419-7759-5_2 |
| Book ISBNs |
978-1-4419-7758-8, 978-1-4419-7759-5
|
| Authors |
Xingcun Colin Tong, Tong, Xingcun Colin |
Mendeley readers
The data shown below were compiled from readership statistics for 32 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 32 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 9 | 28% |
| Lecturer | 3 | 9% |
| Student > Master | 3 | 9% |
| Student > Bachelor | 2 | 6% |
| Professor | 1 | 3% |
| Other | 2 | 6% |
| Unknown | 12 | 38% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 13 | 41% |
| Materials Science | 3 | 9% |
| Chemical Engineering | 1 | 3% |
| Energy | 1 | 3% |
| Unknown | 14 | 44% |