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Mendeley readers
| Chapter title |
High Thermal Conductivity Metal Matrix Composites
|
|---|---|
| Chapter number | 6 |
| Book title |
Advanced Materials for Thermal Management of Electronic Packaging
|
| Published by |
Springer, New York, NY, January 2011
|
| DOI | 10.1007/978-1-4419-7759-5_6 |
| Book ISBNs |
978-1-4419-7758-8, 978-1-4419-7759-5
|
| Authors |
Xingcun Colin Tong, Tong, Xingcun Colin |
Mendeley readers
The data shown below were compiled from readership statistics for 39 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 39 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 9 | 23% |
| Student > Master | 5 | 13% |
| Researcher | 5 | 13% |
| Student > Doctoral Student | 4 | 10% |
| Professor > Associate Professor | 2 | 5% |
| Other | 4 | 10% |
| Unknown | 10 | 26% |
| Readers by discipline | Count | As % |
|---|---|---|
| Engineering | 18 | 46% |
| Materials Science | 4 | 10% |
| Chemical Engineering | 2 | 5% |
| Social Sciences | 2 | 5% |
| Unspecified | 2 | 5% |
| Other | 2 | 5% |
| Unknown | 9 | 23% |