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Timeline
Chapter title |
Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA Package
|
---|---|
Chapter number | 10 |
Book title |
Microelectronic Interconnections and Assembly
|
Published by |
Springer, Dordrecht, January 1998
|
DOI | 10.1007/978-94-011-5135-1_10 |
Book ISBNs |
978-9-40-106159-9, 978-9-40-115135-1
|
Authors |
Peter Bodo, Hans Hentzell, Jan Strandberg, Joacim Haglund, Sima Valizadeh, Bodo, Peter, Hentzell, Hans, Strandberg, Jan, Haglund, Joacim, Valizadeh, Sima |