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Chapter title |
Microwelding of Leads to the Film Structures Working at Elevated Temperatures
|
---|---|
Chapter number | 20 |
Book title |
Microelectronic Interconnections and Assembly
|
Published by |
Springer, Dordrecht, January 1998
|
DOI | 10.1007/978-94-011-5135-1_20 |
Book ISBNs |
978-9-40-106159-9, 978-9-40-115135-1
|
Authors |
T. Pisarkiewicz, T. Habdank-Wojewodzki, M. Ciez |