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Chapter title |
Thermal Simulation and Characterization of Single Chip Packages
|
---|---|
Chapter number | 5 |
Book title |
Microelectronic Interconnections and Assembly
|
Published by |
Springer, Dordrecht, January 1998
|
DOI | 10.1007/978-94-011-5135-1_5 |
Book ISBNs |
978-9-40-106159-9, 978-9-40-115135-1
|
Authors |
Orla Slattery, Ciaran Cahill, John Barrett, Martin O’Flaherty, Kenneth Rodgers, Slattery, Orla, Cahill, Ciaran, Barrett, John, O’Flaherty, Martin, Rodgers, Kenneth |