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Microelectronic Interconnections and Assembly

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Cover of 'Microelectronic Interconnections and Assembly'

Table of Contents

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    Book Overview
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    Chapter 1 The Packaging & Interconnection Trends in the Nordic Microelectronics Industry
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    Chapter 2 IC Packaging for Miniaturised Consumer Electronics
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    Chapter 3 The Move Towards Further Miniaturisation
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    Chapter 4 Plastic Packaging is Highly Reliable
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    Chapter 5 Thermal Simulation and Characterization of Single Chip Packages
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    Chapter 6 Current Trends and Future Issues in Solderability
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    Chapter 7 The At-Temperature Mechanical Properties of Lead-Tin Based Alloys
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    Chapter 8 Flip Chip Technology: Is It Time of Mass Production?
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    Chapter 9 Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale Packaging
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    Chapter 10 Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA Package
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    Chapter 11 Solder Bumping for Flip Chip Interconnections
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    Chapter 12 Reliability of Solder Joint Interconnections in Thermally Matched Assemblies
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    Chapter 13 Mechanical Stress in Microelectronic Interconnects
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    Chapter 14 Low Cost Interconnection Technology for Fast Prototyping of Multichip Modules
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    Chapter 15 Opto-Electronic Multi-Chip Modules (OE-MCMs): Current R&D and Applications to Microelectronic Interconnections
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    Chapter 16 On Thin Film MCM-D Interconnects
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    Chapter 17 VLSI Interconnection by Bumpless TAB
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    Chapter 18 Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001
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    Chapter 19 Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - a Comparative Study
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    Chapter 20 Microwelding of Leads to the Film Structures Working at Elevated Temperatures
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    Chapter 21 New Trends in the Integration and Education in Microsystems Technology
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    Chapter 22 MCM Implementation of a 2.5 Gb/s ATM switch
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    Chapter 23 Processing and Performance of High Dielectric Permeability Thin Anodised Films in Multilayer Structures for MCM(D) High Speed Digital Applications
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    Chapter 24 Optical Interconnection Elements Investigation in Chalcogenide Glass Layers for Integrated Optics
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    Chapter 25 Material Composition Changes During High Temperature Annealing and Electrochemical Migration Reliability
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    Chapter 26 Nonlinearity between Interconnection and Resistive Layer
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    Chapter 27 Education in Hybrid Microelectronics at the University of Brno
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    Chapter 28 Thick Film Interconnections for Sensor Applications
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    Chapter 29 PTF (Polymer Thick Film) Interconnections in Term of Long Time Reliability
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    Chapter 30 The Usage of the Polymer Inks in Interconnection Technology
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    Chapter 31 Production of metallic patterns with the help of highresolution inorganic resists
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Title
Microelectronic Interconnections and Assembly
Published by
Springer Netherlands, December 2012
DOI 10.1007/978-94-011-5135-1
ISBNs
978-9-40-106159-9, 978-9-40-115135-1
Editors

Harman, George, Mach, Pavel

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 2 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 2 100%

Demographic breakdown

Readers by professional status Count As %
Lecturer > Senior Lecturer 1 50%
Student > Ph. D. Student 1 50%
Readers by discipline Count As %
Engineering 2 100%