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Chapter title |
Material Composition Changes During High Temperature Annealing and Electrochemical Migration Reliability
|
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Chapter number | 25 |
Book title |
Microelectronic Interconnections and Assembly
|
Published by |
Springer, Dordrecht, January 1998
|
DOI | 10.1007/978-94-011-5135-1_25 |
Book ISBNs |
978-9-40-106159-9, 978-9-40-115135-1
|
Authors |
Gábor Harsányi, Liana Pernes, W. Kinzy Jones, Harsányi, Gábor, Pernes, Liana, Jones, W. Kinzy |