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Timeline
Chapter title |
Mechanical Stress in Microelectronic Interconnects
|
---|---|
Chapter number | 13 |
Book title |
Microelectronic Interconnections and Assembly
|
Published by |
Springer, Dordrecht, January 1998
|
DOI | 10.1007/978-94-011-5135-1_13 |
Book ISBNs |
978-9-40-106159-9, 978-9-40-115135-1
|
Authors |
Peter J. Gielisse, Meirong Tu, Dongming Y. White, Yang Xu Famu-Fsu, Gielisse, Peter J., Tu, Meirong, White, Dongming Y., Famu-Fsu, Yang Xu |