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Reliability, Yield, and Stress Burn-In

Overview of attention for book
Cover of 'Reliability, Yield, and Stress Burn-In'

Table of Contents

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    Book Overview
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    Chapter 1 Overview of Design, Manufacture, and Reliability
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    Chapter 2 Integrating Reliability into Microelectronics Manufacturing
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    Chapter 3 Basic Reliability Concept
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    Chapter 4 Yield and Modeling Yield
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    Chapter 5 Reliability Stress Tests
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    Chapter 6 Burn-in Performance, Cost, and Statistical Analysis
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    Chapter 7 Nonparametric Reliability Analysis
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    Chapter 8 Parametric Approaches To Decide Optimal System Burn-in Time
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    Chapter 9 Nonparametric Approach and Its Applications to Burn-in
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    Chapter 10 Nonparametric Bayesian Approach for Optimal Burn-in
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    Chapter 11 The Dirichlet Process for Reliability Analysis
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    Chapter 12 Software Reliability and Infant Mortality Period of the Bathtub Curve
Attention for Chapter 11: The Dirichlet Process for Reliability Analysis
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Chapter title
The Dirichlet Process for Reliability Analysis
Chapter number 11
Book title
Reliability, Yield, and Stress Burn-In
Published by
Springer, Boston, MA, January 1998
DOI 10.1007/978-1-4615-5671-8_11
Book ISBNs
978-0-7923-8107-5, 978-1-4615-5671-8
Authors

Way Kuo, Wei-Ting Kary Chien, Taeho Kim

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