↓ Skip to main content
What is this page? Embed badge

Copper Electrodeposition for Nanofabrication of Electronics Devices

Overview of attention for book
Cover of 'Copper Electrodeposition for Nanofabrication of Electronics Devices'

Table of Contents

  1. Altmetric Badge
    Book Overview
  2. Altmetric Badge
    Chapter 1 Copper Electrodepositon
  3. Altmetric Badge
    Chapter 2 Supression Effect and Additive Chemistry
  4. Altmetric Badge
    Chapter 3 Acceleration Effect
  5. Altmetric Badge
    Chapter 4 Modeling and Simulation
  6. Altmetric Badge
    Chapter 5 Copper Electrodeposition for Nanofabrication of Electronics Devices
  7. Altmetric Badge
    Chapter 6 Microstructure Evolution of Copper in Nanoscale Interconnect Features
  8. Altmetric Badge
    Chapter 7 Direct Copper Plating
  9. Altmetric Badge
    Chapter 8 Through Silicon Via
  10. Altmetric Badge
    Chapter 9 Build-up Printed Wiring Boards (Build-up PWBs)
  11. Altmetric Badge
    Chapter 10 Copper Foil Smooth on Both Sides for Lithium-Ion Battery
  12. Altmetric Badge
    Chapter 11 Through Hole Plating
  13. Altmetric Badge
    Chapter 12 Erratum to: Acceleration Effect
Attention for Chapter 3: Acceleration Effect
Altmetric Badge

Citations

dimensions_citation
65 Dimensions

Readers on

mendeley
1 Mendeley
Summary Dimensions citations
So far, Dimensions has found 65 publications that cite this research output.

65

The most recent citing publications are shown below. View all 65 publications that cite this research output on Dimensions.

This page shows the most recent citations of this research output.

Click here to find out how to access more activity.

This page is provided by Altmetric.