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| Chapter title |
Build-up Printed Wiring Boards (Build-up PWBs)
|
|---|---|
| Chapter number | 9 |
| Book title |
Copper Electrodeposition for Nanofabrication of Electronics Devices
|
| Published by |
Springer, New York, NY, January 2014
|
| DOI | 10.1007/978-1-4614-9176-7_9 |
| Book ISBNs |
978-1-4614-9175-0, 978-1-4614-9176-7
|
| Authors |
Kiyoshi Takagi, Toshikazu Okubo, Takagi, Kiyoshi, Okubo, Toshikazu |