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| Chapter title |
Microstructure Evolution of Copper in Nanoscale Interconnect Features
|
|---|---|
| Chapter number | 6 |
| Book title |
Copper Electrodeposition for Nanofabrication of Electronics Devices
|
| Published by |
Springer, New York, NY, January 2014
|
| DOI | 10.1007/978-1-4614-9176-7_6 |
| Book ISBNs |
978-1-4614-9175-0, 978-1-4614-9176-7
|
| Authors |
James Kelly, Christopher Parks, James Demarest, Juntao Li, Christopher Penny, Kelly, James, Parks, Christopher, Demarest, James, Li, Juntao, Penny, Christopher |