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Copper Electrodeposition for Nanofabrication of Electronics Devices

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Cover of 'Copper Electrodeposition for Nanofabrication of Electronics Devices'

Table of Contents

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    Book Overview
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    Chapter 1 Copper Electrodepositon
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    Chapter 2 Supression Effect and Additive Chemistry
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    Chapter 3 Acceleration Effect
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    Chapter 4 Modeling and Simulation
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    Chapter 5 Copper Electrodeposition for Nanofabrication of Electronics Devices
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    Chapter 6 Microstructure Evolution of Copper in Nanoscale Interconnect Features
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    Chapter 7 Direct Copper Plating
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    Chapter 8 Through Silicon Via
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    Chapter 9 Build-up Printed Wiring Boards (Build-up PWBs)
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    Chapter 10 Copper Foil Smooth on Both Sides for Lithium-Ion Battery
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    Chapter 11 Through Hole Plating
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    Chapter 12 Erratum to: Acceleration Effect
Attention for Chapter 8: Through Silicon Via
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