Integrated Circuit Packaging, Assembly and Interconnections
Overview of attention for book
Table of Contents
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Altmetric BadgeBook Overview
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Altmetric BadgeChapter 1 Electronic Manufacturing and the Integrated Circuit
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Altmetric BadgeChapter 2 Integrated Circuit Manufacturing: A Technology Resource
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Altmetric BadgeChapter 3 Packaging the IC—Single Chip Packaging
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Altmetric BadgeChapter 4 The Chip Scale Package
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Altmetric BadgeChapter 5 Multichip Packaging
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Altmetric BadgeChapter 6 Known Good Die (KGD)
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Altmetric BadgeChapter 7 Packaging Options—Chip on Board
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Altmetric BadgeChapter 8 Chip & Wire Assembly
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Altmetric BadgeChapter 9 Tape Automated Bonding—TAB
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Altmetric BadgeChapter 10 Flip Chip—The Bumping Processes
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Altmetric BadgeChapter 11 Flip Chip Assembly
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Altmetric BadgeChapter 12 HDI Substrate Manufacturing Technologies: Thin Film Technology
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Altmetric BadgeChapter 13 HDI Substrate Manufacturing Technologies: Thick Film Technology
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Altmetric BadgeChapter 14 HDI Substrate Manufacturing Technologies: Cofired Ceramic
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Altmetric BadgeChapter 15 Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate