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Chapter title |
3D Chip/Package Co-analysis of Stress-Induced Timing Variations
|
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Chapter number | 16 |
Book title |
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
|
Published by |
Springer, New York, NY, January 2013
|
DOI | 10.1007/978-1-4419-9542-1_16 |
Book ISBNs |
978-1-4419-9541-4, 978-1-4419-9542-1
|
Authors |
Sung Kyu Lim |