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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

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Cover of 'Design for High Performance, Low Power, and Reliable 3D Integrated Circuits'

Table of Contents

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    Book Overview
  2. Altmetric Badge
    Chapter 1 Regular Versus Irregular TSV Placement for 3D IC
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    Chapter 2 Steiner Routing for 3D IC
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    Chapter 3 Buffer Insertion for 3D IC
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    Chapter 4 Low Power Clock Routing for 3D IC
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    Chapter 5 Power Delivery Network Design for 3D IC
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    Chapter 6 3D Clock Routing for Pre-bond Testability
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    Chapter 7 TSV-to-TSV Coupling Analysis and Optimization
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    Chapter 8 TSV Current Crowding and Power Integrity
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    Chapter 9 Modeling of Atomic Concentration at the Wire-to-TSV Interface
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    Chapter 10 Multi-objective Architectural Floorplanning for 3D IC
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    Chapter 11 Thermal-Aware Gate-Level Placement for 3D IC
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    Chapter 12 3D IC Cooling with Micro-Fluidic Channels
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    Chapter 13 Mechanical Reliability Analysis and Optimization for 3D ICs
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    Chapter 14 Impact of Mechanical Stress on Timing Variation for 3D IC
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    Chapter 15 Chip/Package Co-analysis of Mechanical Stress for 3D IC
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    Chapter 16 3D Chip/Package Co-analysis of Stress-Induced Timing Variations
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    Chapter 17 TSV Interfacial Crack Analysis and Optimization
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    Chapter 18 Ultra High Density Logic Designs Using Monolithic 3D Integration
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    Chapter 19 Impact of TSV Scaling on 3D IC Design Quality
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    Chapter 20 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory
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2 Wikipedia pages

Citations

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41 Dimensions

Readers on

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33 Mendeley
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Title
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Published by
Springer New York, January 2013
DOI 10.1007/978-1-4419-9542-1
ISBNs
978-1-4419-9541-4, 978-1-4419-9542-1
Authors

Sung Kyu Lim, Lim, Sung Kyu

Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 33 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 33 100%

Demographic breakdown

Readers by professional status Count As %
Student > Ph. D. Student 12 36%
Student > Bachelor 3 9%
Researcher 3 9%
Professor > Associate Professor 3 9%
Student > Master 3 9%
Other 4 12%
Unknown 5 15%
Readers by discipline Count As %
Engineering 15 45%
Computer Science 6 18%
Business, Management and Accounting 1 3%
Agricultural and Biological Sciences 1 3%
Materials Science 1 3%
Other 1 3%
Unknown 8 24%