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Chapter title |
Process and Key Technology of Typical Advanced Packaging
|
---|---|
Chapter number | 57 |
Book title |
Handbook of Integrated Circuit Industry
|
Published by |
Springer, Singapore, January 2024
|
DOI | 10.1007/978-981-99-2836-1_57 |
Book ISBNs |
978-9-81-992835-4, 978-9-81-992836-1
|
Authors |
Liang, Steve Xinfu, Liang, Chihchung, Guo, Hongyan, Liu, Weidong, Bao, Xusheng |