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Mendeley readers
Chapter title |
Design Technologies for Advanced Packaging
|
---|---|
Chapter number | 58 |
Book title |
Handbook of Integrated Circuit Industry
|
Published by |
Springer, Singapore, January 2024
|
DOI | 10.1007/978-981-99-2836-1_58 |
Book ISBNs |
978-9-81-992835-4, 978-9-81-992836-1
|
Authors |
Li, Jun, Zhou, Yunyan, Miao, Min, Wang, Wei, Su, Fei, Liu, Fengman |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Researcher | 1 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Unknown | 1 | 100% |