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Handbook of Integrated Circuit Industry

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Cover of 'Handbook of Integrated Circuit Industry'

Table of Contents

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    Book Overview
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    Chapter 1 Invention and Technological Progresses of Integrated Circuits
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    Chapter 2 Characteristics and Strategic Significance of IC Industry
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    Chapter 3 The Development Law of the IC Industry
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    Chapter 4 Development of World IC Industry
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    Chapter 5 Development of Regional IC Industry
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    Chapter 6 Information Security in Integrated Circuits
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    Chapter 7 Integrated Circuit Intellectual Property
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    Chapter 8 International Competition and Cooperation
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    Chapter 9 Integrated Circuit Enterprise Management
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    Chapter 10 Talent Cultivation
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    Chapter 11 Development and Classification of IC
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    Chapter 12 Classification of IC Products by Manufacturing Processes
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    Chapter 13 Products of Digital Integrated Circuit
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    Chapter 14 Analog and Mixed-Signal IC Products
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    Chapter 15 Radio Frequency IC Products
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    Chapter 16 Products of Power Devices
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    Chapter 17 Products of Optoelectronic Devices
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    Chapter 18 Products of Sensors and MEMS
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    Chapter 19 Applications of IC Products in Consumer, Computer, and Communication Electronics
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    Chapter 20 Applications of IC Products in Automotive, Industrial, and Medical Equipment
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    Chapter 21 Applications of IC Products in Aero-Mil
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    Chapter 22 Economic and Financial Theories Related to IC Industry
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    Chapter 23 Development Law and Development Index of IC Industry
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    Chapter 24 Financial Management Practice and Analysis of Enterprises
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    Chapter 25 Investment and Financing of IC Industry
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    Chapter 26 Development History of IC Production Lines
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    Chapter 27 Location and Environmental Impact Assessment of IC Production Lines
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    Chapter 28 Designing IC Production Lines
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    Chapter 29 Clean Room and Air Conditioning Systems
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    Chapter 30 Central Gas and Chemical Supply Systems
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    Chapter 31 Construction and Management of IC Production Lines
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    Chapter 32 Hazardous Chemicals Management
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    Chapter 33 Energy Savings and Development Trends
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    Chapter 34 Overview of IC Design
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    Chapter 35 Basics of Integrated Circuit Design
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    Chapter 36 Digital Integrated Circuit Design
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    Chapter 37 Analog Integrated Circuit Design
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    Chapter 38 RF Integrated Circuit Design
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    Chapter 39 Power Integrated Circuit
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    Chapter 40 Design of Processors
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    Chapter 41 Memory Design
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    Chapter 42 SoC Design
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    Chapter 43 Programmable Logic Circuit Design
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    Chapter 44 Electronic Design Automation Tools
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    Chapter 45 The Evolution of IC Manufacturing Technology
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    Chapter 46 Silicon-Based Integrated Circuits
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    Chapter 47 Compound Semiconductor Device and IC
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    Chapter 48 Micro Electro-Mechanical Systems (MEMS)
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    Chapter 49 Unit Processes
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    Chapter 50 Module Processes
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    Chapter 51 Integration
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    Chapter 52 Types of Integrated Circuit Corporations
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    Chapter 53 Management and Modes of IC Manufacturing Enterprises
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    Chapter 54 Development of Packaging and Testing Industry
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    Chapter 55 Integrated Circuit Package Types
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    Chapter 56 Key Technologies and Processes for Traditional Packaging
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    Chapter 57 Process and Key Technology of Typical Advanced Packaging
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    Chapter 58 Design Technologies for Advanced Packaging
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    Chapter 59 Integrated Circuit Testing Technology
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    Chapter 60 Integrated Circuits Packaging Reliability
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    Chapter 61 Standardization of Integrated Circuits Packaging
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    Chapter 62 The Development of the IC Equipment Industry
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    Chapter 63 Manufacturing Equipment for Silicon Wafer
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    Chapter 64 Mask Manufacturing Equipment
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    Chapter 65 Lithography Equipment
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    Chapter 66 Diffusion and Ion Implantation Equipment
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    Chapter 67 Thin Film Growth Equipment
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    Chapter 68 Plasma Etch Equipment
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    Chapter 69 Wet Cleaning Equipment
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    Chapter 70 Metrology and Inspection Equipment
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    Chapter 71 Packaging and Assembly Equipment
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    Chapter 72 Main Common Parts
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    Chapter 73 Integrated Circuit-Testing Equipment
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    Chapter 74 Silicon Materials
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    Chapter 75 Silicon Wafer Processing
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    Chapter 76 Defects and Impurities in Silicon Materials
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    Chapter 77 Compound Semiconductors
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    Chapter 78 Photomask and Photoresist
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    Chapter 79 Auxiliary Material in Process
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    Chapter 80 Package Structure Materials
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    Chapter 81 Non-traditional New Structure Devices
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    Chapter 82 New Type ICs
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    Chapter 83 New Materials Used in IC
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    Chapter 84 Advanced IC Manufacturing Processes
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    Chapter 85 New Technology in Integration and Interconnection
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    Chapter 86 Modeling and Simulation of Nano-devices
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    Chapter 87 Flexible Semiconductor Devices (FSD)
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    Chapter 88 Integrated Microsystem Technology
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    Chapter 89 Advanced Characterization and Testing Techniques
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    Chapter 90 Aerospace Microelectronics
Overall attention for this book and its chapters
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Title
Handbook of Integrated Circuit Industry
Published by
Springer Nature Singapore, November 2023
DOI 10.1007/978-981-99-2836-1
ISBNs
978-9-81-992835-4, 978-9-81-992836-1
Editors

Wang, Yangyuan, Chi, Min-Hwa, Lou, Jesse Jen-Chung, Chen, Chun-Zhang

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X Demographics

The data shown below were collected from the profile of 1 X user who shared this research output. Click here to find out more about how the information was compiled.
Mendeley readers

Mendeley readers

The data shown below were compiled from readership statistics for 12 Mendeley readers of this research output. Click here to see the associated Mendeley record.

Geographical breakdown

Country Count As %
Unknown 12 100%

Demographic breakdown

Readers by professional status Count As %
Other 1 8%
Student > Doctoral Student 1 8%
Professor 1 8%
Student > Ph. D. Student 1 8%
Student > Master 1 8%
Other 1 8%
Unknown 6 50%
Readers by discipline Count As %
Engineering 3 25%
Physics and Astronomy 1 8%
Materials Science 1 8%
Design 1 8%
Unknown 6 50%