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Mendeley readers
Chapter title |
Design for Reliability of Solder Joints
|
---|---|
Chapter number | 7 |
Book title |
Assembly and Reliability of Lead-Free Solder Joints
|
Published by |
Springer, Singapore, January 2020
|
DOI | 10.1007/978-981-15-3920-6_7 |
Book ISBNs |
978-9-81-153919-0, 978-9-81-153920-6
|
Authors |
John H. Lau, Ning-Cheng Lee, Lau, John H., Lee, Ning-Cheng |
Mendeley readers
The data shown below were compiled from readership statistics for 1 Mendeley reader of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
Country | Count | As % |
---|---|---|
Unknown | 1 | 100% |
Demographic breakdown
Readers by professional status | Count | As % |
---|---|---|
Unspecified | 1 | 100% |
Readers by discipline | Count | As % |
---|---|---|
Unspecified | 1 | 100% |