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Mendeley readers
| Chapter title |
Solder Joints in PCB Assembly and Semiconductor Packaging
|
|---|---|
| Chapter number | 1 |
| Book title |
Assembly and Reliability of Lead-Free Solder Joints
|
| Published by |
Springer, Singapore, January 2020
|
| DOI | 10.1007/978-981-15-3920-6_1 |
| Book ISBNs |
978-9-81-153919-0, 978-9-81-153920-6
|
| Authors |
John H. Lau, Ning-Cheng Lee, Lau, John H., Lee, Ning-Cheng |
Mendeley readers
The data shown below were compiled from readership statistics for 3 Mendeley readers of this research output. Click here to see the associated Mendeley record.
Geographical breakdown
| Country | Count | As % |
|---|---|---|
| Unknown | 3 | 100% |
Demographic breakdown
| Readers by professional status | Count | As % |
|---|---|---|
| Student > Ph. D. Student | 1 | 33% |
| Unknown | 2 | 67% |
| Readers by discipline | Count | As % |
|---|---|---|
| Materials Science | 1 | 33% |
| Unknown | 2 | 67% |